TGFβR3-based Biomaterial to Treat Bone Damage

Application

PEG-MAL (Poly(ethylene glycol) methyl ether maleimide) polymer gel composition containing soluble TGFβ3R or embedded with modified TGFβ3R over-expressing cells for bone growth and repair therapy.

Key Benefits

  • Targets a non-BMP2 signaling pathway to improve BMP signaling.
  • Avoids complications associated with BMP2.

Market Summary

Whether due to disease, injury, or defect, bone can become damaged and require repair. According to Integra Life sciences there are as many as three million surgeries performed annually worldwide that could require bone replacement tissue. Currently there are few options for improving bone growth and repair including bone grafts, regenerative approaches and bone morphogenic protein 2 (BMP2)-based therapeutic approach. However, current approaches have had limited/moderate success and have certain serious side effects. Alternative strategies which avoid the complications associated with BMP2, are needed for bone growth and repair.

Technical Summary

Emory researcher has developed a PEG-MAL (Poly(ethylene glycol) methyl ether maleimide) polymer composition that is based upon targeting the TGFβ3 receptor (TGFβ3R) for bone growth and repair. TGFβ3R is the most prevalent TGFβ receptor and is believed to regulate molecules involved in cellular adhesion and extracellular matrix formation during the process of palate development. PEG-MAL is ideal for this composition because it can be functionalized with bioactive molecules, self-adheres, degrades and clears efficiently in the body, and produces little to no inflammation. This new technology provides an alternative approach to facilitate TGFβ signaling, avoids complications associated with BMP2 and improves surgical outcomes.

Developmental Stage

In vitro and in vivo experiments have been successfully conducted.

Patent Information

App Type Country Serial No. Patent No. File Date Issued Date Patent Status
Nationalized PCT - United States United States 16/972,800   12/7/2020   Pending
Tech ID: 17006
Published: 9/20/2019